Mini Solderless Breadboard – 170 Tie Points White

The Mini Solderless Breadboard is a compact prototyping platform designed for small electronic circuits and quick testing applications. It features 170 tie points with a standard 2.54 mm pitch, making it suitable for DIP IC breakout, sensor connections, and breadboard-based development projects. The snap-fit design allows multiple boards to connect together for expanded prototyping space, while the self-adhesive backing and M2 mounting holes provide secure installation options. Ideal for embedded systems, educational electronics, and rapid hardware prototyping.

• 170 tie-point solderless prototyping area
  
• Standard 2.54 mm pitch spacing
  
• Compact design for small circuits
  
• Snap-fit edges for board expansion
  
• Peel-and-stick adhesive backing
  
• Dual M2 mounting holes
  
• Compatible with DIP package ICs
  
• Supports reusable circuit prototyping
  
• White ABS plastic housing
  
• Nickel-plated spring contacts
  
• Suitable for jumper wire connections
  
• Lightweight portable construction
  
• No soldering required
  
• Reliable contact retention design
  
• Ideal for educational electronics projects

• Tie Points: 170
  
• Terminal Strip Points: 17 × 10 rows
  
• Pitch Spacing: 2.54 mm
  
• Board Type: Solderless Mini Breadboard
  
• Contact Material: Nickel-Plated Spring Metal
  
• Housing Material: ABS Plastic
  
• Color: White
  
• Mounting Method: Adhesive Backing and M2 Holes
  
• Compatible Wire Size: 20–29 AWG
  
• Board Dimensions: 47 × 35 × 10 mm
  
• Mounting Hole Diameter: M2 Compatible
  
• Reusable: Yes
  
• Operating Temperature: -20°C to 80°C
  
• Application Type: Rapid Circuit Prototyping
• IC Compatibility: DIP Packages

• Mini Solderless Breadboard 3D Model

• How To Use a Breadboard - Breadboard Basics