Half-Size Solderless Breadboard – 400 Tie Points

The Half-Size Solderless Breadboard is a compact prototyping platform designed for electronic circuit development and testing. It features 400 tie points, dual power rails, and a standard 2.54 mm pin spacing compatible with most through-hole components and DIP ICs. The solderless design allows fast circuit modifications without permanent connections, while the self-adhesive backing provides secure mounting during development. Its interlocking side structure enables multiple breadboards to be connected together for larger projects. Ideal for Arduino projects, embedded systems, educational labs, and electronics prototyping.

• 400 tie-point solderless prototyping area
  
• Dual power rails for simplified power distribution
  
• Standard 2.54 mm pitch compatibility
  
• Supports DIP IC placement across center gap
  
• Self-adhesive backing for stable mounting
  
• Interlocking design for expandable configurations
  
• Compatible with 20–29 AWG wires
  
• Nickel-plated contact clips for reliable conductivity
  
• Reusable design for rapid circuit modifications
  
• Compact half-size layout for small projects
  
• Suitable for embedded and educational applications
  
• No soldering required for assembly
  
• Lightweight ABS plastic construction
  
• Compatible with Arduino and Raspberry Pi projects
  
• Color-coded power rails for easy identification

• Tie Points: 400
  
• Terminal Strips: 300 tie points
  
• Power Rails: 100 tie points
  
• Power Buses: 2
  
• Columns: 10
  
• Rows: 30
  
• Pin Pitch: 2.54 mm
  
• Center Gap: 7.62 mm
  
• Supported Wire Size: 20–29 AWG
  
• Mounting Type: Self-adhesive backing
  
• Contact Material: Nickel-plated spring clips
  
• Body Material: ABS plastic
  
• Board Color: White
  
• Reusable: Yes
  
• Interlocking Capability: Supported

• Half-Size Solderless Breadboard 3D Model

• How to Use a Breadboard