Full-Size Solderless Breadboard – 830 Tie Points

The Full-Size Solderless Breadboard is designed for rapid prototyping, circuit testing, and electronics development without soldering. It features 830 tie points with dual split power rails and a standard 2.54 mm pitch layout compatible with DIP ICs, sensors, and development boards. The interlocking design allows multiple boards to be connected for larger projects, while the self-adhesive backing provides secure mounting during operation. Suitable for educational labs, embedded systems development, and electronic prototyping applications.

• 830 total tie points for circuit prototyping
  
• Standard 2.54 mm pin spacing
  
• Dual split power rails design
  
• Compatible with DIP IC packages
  
• 10 terminal columns layout
  
• 63 connection rows configuration
  
• Self-adhesive backing for secure mounting
  
• Interlocking side tabs for board expansion
  
• Supports 20–29 AWG jumper wires
  
• Solderless reusable construction
  
• Nickel-plated contact clips
  
• ABS plastic housing material
  
• Suitable for Arduino and Raspberry Pi projects
  
• Ideal for testing and educational applications
  
• Compact full-size breadboard format

• Total Tie Points: 830
  
• Terminal Strips: 630 tie points
  
• Power Rails: 200 tie points
  
• Terminal Columns: 10 columns
  
• Terminal Rows: 63 rows
  
• Pin Pitch: 2.54 mm
  
• Center Gap: 7.62 mm
  
• Supported Wire Size: 20–29 AWG
  
• Power Rail Type: Split dual rails
  
• Mounting Type: Self-adhesive backing
  
• Board Type: Solderless breadboard
  
• Material: ABS plastic housing
  
• Contact Material: Nickel-plated spring clips
  
• Board Dimensions: 165 × 55 × 9 mm
  
• Compatibility: DIP ICs, Arduino, Raspberry Pi, sensors and modules

• 830 Tie Points Breadboard 3D Model
  

• How To Use a Breadboard - Breadboard Basics